发明名称 |
CURABLE RESIN COMPOSITION |
摘要 |
<p>A curable resin composition comprising: a curable resin (A) containing a hydrolysable silyl group represented by formula (1) in the molecule; a curable resin (B) containing a hydrolysable silyl group represented by formula (2) in the molecule; a basic compound (C); and a non-tin curing catalyst (D). -X-SiR1 a(OR2)3-a ··· Formula (1) (In formula (1), X represents a hydrocarbon group having 2 or more carbon atoms; R1 represents a hydrocarbon group having 1 to 20 carbon atoms; R2 represents a group selected from organic groups each having 1 to 20 carbon atoms; and a represents 0, 1 or 2.) -W-CH2-SiR3 b(OR4)3-b ··· Formula (2) (In formula (2), W represents a binding functional group composed of a methylene group that can bind to a silicon atom contained in a hydrolysable silyl group and a hetero atom having an unshared electron pair and bound to the methylene group; R3 represents a hydrocarbon group having 1 to 20 carbon atoms; R4 represents a group selected from organic groups each having 1 to 20 carbon atoms; and b represents 0, 1 or 2.)</p> |
申请公布号 |
WO2010128602(A1) |
申请公布日期 |
2010.11.11 |
申请号 |
WO2010JP50940 |
申请日期 |
2010.01.26 |
申请人 |
KONISHI CO., LTD.;SATO, SHINICHI;FUJIMOTO, HIROYUKI;NOMURA, YUKIHIRO |
发明人 |
SATO, SHINICHI;FUJIMOTO, HIROYUKI;NOMURA, YUKIHIRO |
分类号 |
C08L101/10;C08K5/544;C09J11/06;C09J133/14;C09J171/02;C09K3/10 |
主分类号 |
C08L101/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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