发明名称 CURABLE RESIN COMPOSITION
摘要 <p>A curable resin composition comprising: a curable resin (A) containing a hydrolysable silyl group represented by formula (1) in the molecule; a curable resin (B) containing a hydrolysable silyl group represented by formula (2) in the molecule; a basic compound (C); and a non-tin curing catalyst (D). -X-SiR1 a(OR2)3-a ··· Formula (1) (In formula (1), X represents a hydrocarbon group having 2 or more carbon atoms; R1 represents a hydrocarbon group having 1 to 20 carbon atoms; R2 represents a group selected from organic groups each having 1 to 20 carbon atoms; and a represents 0, 1 or 2.) -W-CH2-SiR3 b(OR4)3-b ··· Formula (2) (In formula (2), W represents a binding functional group composed of a methylene group that can bind to a silicon atom contained in a hydrolysable silyl group and a hetero atom having an unshared electron pair and bound to the methylene group; R3 represents a hydrocarbon group having 1 to 20 carbon atoms; R4 represents a group selected from organic groups each having 1 to 20 carbon atoms; and b represents 0, 1 or 2.)</p>
申请公布号 WO2010128602(A1) 申请公布日期 2010.11.11
申请号 WO2010JP50940 申请日期 2010.01.26
申请人 KONISHI CO., LTD.;SATO, SHINICHI;FUJIMOTO, HIROYUKI;NOMURA, YUKIHIRO 发明人 SATO, SHINICHI;FUJIMOTO, HIROYUKI;NOMURA, YUKIHIRO
分类号 C08L101/10;C08K5/544;C09J11/06;C09J133/14;C09J171/02;C09K3/10 主分类号 C08L101/10
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