| 摘要 |
PROBLEM TO BE SOLVED: To suppress a component cost, and to improve the production yield. SOLUTION: In a collective substrate (300B) including a first collective substrate part (100B) including a plurality of first circuit boards (11), a second collective substrate part (200B) including a plurality of second circuit boards (31), and a jointing part (330A) for jointing the first collective substrate part (100B) with the second collective substrate part (200B), the joint part (330A) includes separation possibility parts (332, 334) that enable mutual separation between the first and second collective substrate parts (100B), (200B). COPYRIGHT: (C)2011,JPO&INPIT
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