发明名称 RADIATION CURING RESIN COMPOSITION FOR COATING WIRE
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation curing resin composition for coating wires, producing satisfactory efficiency for manufacturing a coating layer, having sufficient strength and satisfactory adhesion to a center conductor. <P>SOLUTION: This radiation curing resin composition for coating wires contains the following components (A), (B), and (D); (A) urethane (metha) acrylate having two or more structure parts derived from aliphatic polyol, (B) a compound having a cyclic structure and one ethylenic unsaturated group, (D) a compound expressed by the formula (4a). (In the formula (4a), R<SP>8</SP>is a univalent organic group which has an ethylenic unsaturated group, and R<SP>9</SP>is a univalent organic group which may have a hydrogen atom or an ethylenic unsaturated group). <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010257952(A) 申请公布日期 2010.11.11
申请号 JP20100063762 申请日期 2010.03.19
申请人 JSR CORP;DSM IP ASSETS BV 发明人 YAMAGUCHI CHUJI;KAMO OSAMU;KUROSAWA TAKAHIKO
分类号 H01B3/30;C08F290/06;H01B7/02 主分类号 H01B3/30
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