发明名称 THERMAL TREATMENT SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermal treatment system, capable of reducing the capacity of power equipment for supplying power to a thermal treatment device having reactors for heat-treating a plurality of boards collectively. <P>SOLUTION: The thermal treatment system has n reactors, performing thermal treatment to the substrate (n is an integer of &ge;2), wherein m first power converters 2a, 2b are prepared for converting three-phase AC power into DC power (m is an integer &ge;2) and second power converters 41-43 are connected to these first power converters 2a, 2b, to supply power to a heater of each reactor. Controllers 5a, 5b controls the sequence of operation of each reactor so that the sum of the consumed powers in heaters 14-16 of the n reactors does not exceed the sum of maximum outputs in the m first power converters 2a, 2b. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010259298(A) 申请公布日期 2010.11.11
申请号 JP20090109967 申请日期 2009.04.28
申请人 TOKYO ELECTRON LTD 发明人 TAKAHASHI TOMOYA;SUGAWARA ICHIKEN;ENOMOTO TADASHI;KOBAYASHI TAKESHI
分类号 H02M7/12;H01L21/205;H01L21/22 主分类号 H02M7/12
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