| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating film having a liquid form and capable of easily forming a thin film by handling and solution application, and usable for a passivation film, a gate insulating film or the like of an electronic component requiring a high insulation property in a low baking temperature condition, for instance, a thin-film transistor. SOLUTION: In a thin film formable by applying a solution of a resin composition, and obtained by post bake below 170°C, the problem can be solved by this insulating thin film having a calorific value≤5 J/g by DSC measurement. COPYRIGHT: (C)2011,JPO&INPIT
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