| 摘要 |
PROBLEM TO BE SOLVED: To suppress deterioration of mounting reliability when connecting a semiconductor device to a mounting substrate through solder while restraining cost increase. SOLUTION: In this semiconductor device 101, a semiconductor chip 1 is arranged on the upper surface of a substrate 2, and a lid body 5 is arranged on the upper surface of a rib 4. Recessed parts 2a, 2a,... extending in the thickness direction of the substrate 2 are formed on side faces of the substrate 2, and a side face part 6 of an external terminal 7 is formed on an inner surface of each recessed part 2a. An upper surface pad 9 is formed at a part exposed from the substrate 2 out of the undersurface of the rib 4. COPYRIGHT: (C)2011,JPO&INPIT
|
