| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure capable of easily cooling electronic components, even if the number of the electronic components to be cooled increases or decreases. SOLUTION: A cooling device 1A includes heat absorbing parts 4 for exchanging heat with cooling object components 3, a cooling part 5 for cooling a refrigerant circulated through the heat absorbing parts 4, and a connecting part 6 for connecting a plurality of the heat absorbing parts 4 to the one cooling part 5 with piping in an attachable and detachable manner. According to the configuration, the plurality of heat absorbing parts 4 can be connected to the one cooling part 5 in an attachable and detachable manner, through the connecting part 6. COPYRIGHT: (C)2011,JPO&INPIT
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