| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a power conversion apparatus for reducing the case size, as much as possible, and stabilizing the clamp positions of semiconductor modules with respect to cooling pipes. <P>SOLUTION: The method of manufacturing the power conversion apparatus 1 includes: a process for disposing a temporary assembling body 30, where a plurality of cooling pipes 3 are connected mutually and temporarily at a connection pipe section 32, in the case 2; a process for disposing the semiconductor module 4 between the cooling pipes 3 in the temporary assembling body 30; a press process for allowing a cooling pipe 3A at one side to face one wall surface 21 in the case 2, pressurizing a cooling pipe 3B at the other side by a pressing tool 7, fitting the connection pipe sections 32 mutually, and forming an assembly body 40, where the semiconductor module 4 is clamped among the plurality of cooling pipes 3; and a process for disposing a pressurizing spring for retaining a clamp state at the assembly body 40 in a space 23 formed between the cooling pipe 3B at the other side and the other wall surface 22 in the case 2 in pressurization by the pressing tool 7. <P>COPYRIGHT: (C)2011,JPO&INPIT |
