发明名称 ELECTRONIC COMPONENT MOUNTING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To find a contamination in the early stages to avoid an unnecessary follow-on mounting of electronic components. <P>SOLUTION: When an abnormal drop of an electronic component is determined by a CPU (central processing unit) in a step of sequentially mounting the electronic components on a printed circuit board (S5), an inspection for the existence of the contamination is conducted at the mounting point before and after the occurrence of the abnormal conditions (S6). When the CPU determines the abnormal conditions (S8) to control to stop the mounting operation of the electronic component of an electronic component mounting device, visually and aurally notifying the existence of the contamination on the printed circuit board by a notifying means (S9). <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010258115(A) 申请公布日期 2010.11.11
申请号 JP20090104580 申请日期 2009.04.23
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD;HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 ONO TETSUJI;KANO YOSHINORI;YAMAGUCHI HARUHIKO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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