发明名称 |
Die Exposed Chip Package |
摘要 |
This disclosure describes a chip package. In one embodiment, a semiconductor chip package includes a thermal dissipater placed on top of an integrated-circuit die, the thermal dissipater having a same or similar coefficient of thermal expansion as that of the integrated-circuit die.
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申请公布号 |
US2010283143(A1) |
申请公布日期 |
2010.11.11 |
申请号 |
US20100772869 |
申请日期 |
2010.05.03 |
申请人 |
LIU CHENGLIN;LIOU SHIANN-MING |
发明人 |
LIU CHENGLIN;LIOU SHIANN-MING |
分类号 |
H01L23/34;H01L21/50;H01L23/48 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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