This disclosure describes a chip package. In one embodiment, a semiconductor chip package includes a thermal dissipater placed on top of an integrated-circuit die, the thermal dissipater having a same or similar coefficient of thermal expansion as that of the integrated-circuit die.
申请公布号
WO2010129484(A1)
申请公布日期
2010.11.11
申请号
WO2010US33436
申请日期
2010.05.03
申请人
MARVELL WORLD TRADE LTD.;LIU, CHENGLIN;LIOU, SHIANN-MING