| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic flip-chip mounting method with les variance in the electrode junction state between a semiconductor chip and a substrate. <P>SOLUTION: The ultrasonic flip-chip mounting method includes a step of forming a plurality of bump electrodes (106), on one main surface of a semiconductor chip (100) and a step of respectively bringing the bump electrodes (106) into contact with the corresponding conductor patterns (132) on the substrate and for applying ultrasonic vibration to the semiconductor chip, where the electrode patterns (132) are oriented, in a direction oblique to the ultrasonic vibration direction V. In this way, an effective width W1 (W1>W) is obtained which can contribute to the ultrasonic vibration of the electrode patterns (132). <P>COPYRIGHT: (C)2011,JPO&INPIT |
