LASER BEAM MACHINING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of performing microfabrication with high precision.

SOLUTION: The laser beam machining apparatus includes: a pure water feeding nozzle 14 that feeds pure water to the surface of a wafer 1 held on an X-Y-θtable 12; an air feeding nozzle 15 for feeding air to the surface of the pure water supplied to the surface of the wafer 1; a synthetic quarts plate 16 arranged in the upper part of the air feeding nozzle 15; a water drip sucking nozzle 17; and a laser beam irradiation mechanism 20 for irradiating the wafer 1 with a laser beam L. Then, by jetting an air flow in the pure water flowing direction from a slit on the pure water flowing side of the air feeding nozzle 15, the film thickness of the pure water flow can be made extremely small.

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