CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION KIT, AND METHOD FOR PREPARING THE CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION

摘要

PROBLEM TO BE SOLVED: To provide a means for always at a stable quality providing a chemical mechanical polishing aqueous dispersion preparation kit for rapidly and flatly polishing a workpiece provided with a wiring layer containing tungsten; and more particularly, to provide a chemical mechanical polishing aqueous dispersion preparation kit for ensuring the long-term preservation stability of a colloidal silica contained in the chemical mechanical polishing aqueous dispersion.

SOLUTION: This chemical mechanical polishing aqueous dispersion preparation kit is a kit for polishing a workpiece provided with a wiring layer containing tungsten includes: a first composition containing (A) at least colloidal silica and (B) a basic compound and having a pH of 8-11; a second composition containing at least (C) cationic water-soluble polymer and (D) an acidic compound and having a pH of 1-3; and a third composition containing at least (E) an iron (III) compound and water.

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