发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the occurrence of electrostatic destructions in a wiring board having an insulating substrate, while controlling the temperature of the insulating substrate. SOLUTION: A table 40 has a table surface 40S which can arrange the wiring board 30 having the insulating substrate 10 on which a wiring Z extended in a first direction D1 is arranged, a linear groove 41 which is formed on the table surface 40S, and extended in the direction crossing with the first direction D1, an inlet 42A which is formed in the groove 41 to inject a gas, and an exhaust port 43A which is formed in the groove 41 and exhausts the gas injected from the inlet 42A. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010258374(A) 申请公布日期 2010.11.11
申请号 JP20090109746 申请日期 2009.04.28
申请人 TOSHIBA MOBILE DISPLAY CO LTD 发明人 KAWAMURA TETSUYA
分类号 H01L21/683;C23C14/50;C23C16/458;H01L21/027;H01L21/205;H01L21/3065 主分类号 H01L21/683
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