| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a package, capable of performing a continuity test before thermo-compression bonding, to provide its connecting method, and further to provide an anisotropic conductive film. <P>SOLUTION: In the method of manufacturing a package wherein an electronic member (e.g., a flexible printed board) is compression-bonded in a wiring board (e.g., a rigid wiring board) through an anisotropic conductive film 1, adhering-agent layers 3, 4 are formed on both the surfaces of an intermediate layer 2 as the anisotropic conductive film, and further, conductive particles 5 are dispersed in the intermediate layer 2, and moreover, the anisotropic conductive film, wherein the thickness of the intermediate layer 2 is not larger than the 1.5 times of the average size of the conductive particle, is used. After the flexible printed board is compression-boned to the rigid wiring board at an ordinary temperature through the anisotropic conductive film 1, the conductive continuity test is performed and when its conductive continuity is determined so as to be good as the result of the conductive continuity test, thereafter, the thermo-compression of the intermediate layer 2 is performed by heating. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
