发明名称 COVERLAY FILM FOR FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a coverlay film for a flexible wiring board, in which occurrence of a curl is suppressed, which is superior in workability when a flexible wiring board is manufactured, improves productivity of the flexible wiring board, and has a small discard amount of release paper. SOLUTION: The coverlay film 1 for the flexible wiring board is provided with: release paper 2; and a pair of coverlay film pieces 3 which have heat resistant insulating films 31 and adhesive layers 32 laminated on the heat resistant insulating films 31 and are stuck to both main faces of release paper 2 so that they are peelable with the adhesive layers 32 turned inside. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010258338(A) 申请公布日期 2010.11.11
申请号 JP20090108978 申请日期 2009.04.28
申请人 KYOCERA CHEMICAL CORP 发明人 YOSHINARI YUTAKA;MAEZAWA HIDEKI
分类号 H05K3/28 主分类号 H05K3/28
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