| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME |
| 摘要 |
An upper surface of a semiconductor substrate includes a first portion where a dielectric film is provided, and a second portion where the dielectric film is not provided, wherein the second portion is located in the periphery of the first portion. The upper surface of the semiconductor substrate is covered with a sealing resin.
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| 申请公布号 |
US2010283129(A1) |
申请公布日期 |
2010.11.11 |
| 申请号 |
US20100773507 |
申请日期 |
2010.05.04 |
| 申请人 |
TETANI MICHINARI;YUI TAKASHI;FUJISAKU MINORU |
发明人 |
TETANI MICHINARI;YUI TAKASHI;FUJISAKU MINORU |
| 分类号 |
H01L23/544;H01L21/77 |
主分类号 |
H01L23/544 |
| 代理机构 |
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