| 发明名称 |
LEAD FRAME FOR SEMICONDUCTOR DEVICE |
| 摘要 |
A lead frame including a lead frame structure having a die support area and a plurality of electrical contact areas has shallow recesses formed on a surface of the lead frame structure.
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| 申请公布号 |
US2010283135(A1) |
申请公布日期 |
2010.11.11 |
| 申请号 |
US20100753118 |
申请日期 |
2010.04.02 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC |
发明人 |
YAO JINZHONG;BAI ZHIGANG;LUO JUNHUA;SONG MEIJIANG;ZHU HONG |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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