Heat insulation substance, useful e.g. in molded bodies, bricks, which does not exhibit adhesive, in the form of liquid, in which the particles are bonded together and are treated with non-volatile organosilane or organosiloxane

摘要

Heat insulation substance, which does not exhibit adhesive, in the form of liquid, in which the particles are bonded together and the particles are treated with non-volatile organosilane or organosiloxane, whose boiling point is greater than 130[deg] C at normal pressure, where the thermal conductivity (lambda ) of the heat insulation substance is 0.014-0.040 W/mK and the density of the heat insulation substance is 50-300 kg/m 3>, is claimed.