发明名称 |
Electrical interconnect using locally conductive adhesive |
摘要 |
An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.
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申请公布号 |
US7829190(B2) |
申请公布日期 |
2010.11.09 |
申请号 |
US20050212071 |
申请日期 |
2005.08.25 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
COBBLEY CHAD A.;HEPPLER STEVE W. |
分类号 |
B32B9/00;H01R4/04;H05K3/32 |
主分类号 |
B32B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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