发明名称 Electrical interconnect using locally conductive adhesive
摘要 An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.
申请公布号 US7829190(B2) 申请公布日期 2010.11.09
申请号 US20050212071 申请日期 2005.08.25
申请人 MICRON TECHNOLOGY, INC. 发明人 COBBLEY CHAD A.;HEPPLER STEVE W.
分类号 B32B9/00;H01R4/04;H05K3/32 主分类号 B32B9/00
代理机构 代理人
主权项
地址