发明名称 METHOD FOR FABRICATING PATTERNS ON WAFER BY EXPOSURE PROCESS
摘要 <p>PURPOSE: A method is provided to control a pattern defect in the partial field region of a wafer edge region and to form a wafer pattern like a storage node. CONSTITUTION: A fence(410) has an inclined side towards the inner direction of a wafer in the edge part of the wafer(100). A first photoresist layer is extended to cover the fence on the wafer. An opening hole passes through a sacrificial layer through an etching process. A second photoresist comprises a negative resist.</p>
申请公布号 KR20100119163(A) 申请公布日期 2010.11.09
申请号 KR20090038126 申请日期 2009.04.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 YANG, HYUN JO
分类号 H01L21/027;H01L21/8242 主分类号 H01L21/027
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