发明名称 |
Device for removing solder material from a soldered joint |
摘要 |
In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.
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申请公布号 |
US7829817(B2) |
申请公布日期 |
2010.11.09 |
申请号 |
US20030398784 |
申请日期 |
2003.08.04 |
申请人 |
PAC TECH-PACKAGING TECHNOLOGIES GMBH |
发明人 |
ZAKEL ELKE;KASULKE PAUL;UEBEL OLIVER;TITERLE LARS |
分类号 |
B23K26/00;B23K1/018;B23K26/14 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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