发明名称 |
Integrated circuit package system employing device stacking |
摘要 |
An integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and over the electrical interconnect system; connecting the first device and the second device to the inner lead-finger system; and connecting the third device to the outer lead-finger system. |
申请公布号 |
US7830020(B2) |
申请公布日期 |
2010.11.09 |
申请号 |
US20070766787 |
申请日期 |
2007.06.21 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
DAHILIG FREDERICK RODRIGUEZ;ALVAREZ SHEILA MARIE L.;DIMAANO, JR. ANTONIO B.;MERILO DIOSCORO A. |
分类号 |
H01L23/48;H01L21/58;H01L21/60;H01L29/41 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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