发明名称 Method and system for controlling bake plate temperature in a semiconductor processing chamber
摘要 A method of operating a bake plate disposed in a semiconductor processing chamber having a face plate opposing the bake plate includes providing a temperature control signal to the bake plate and measuring a face plate temperature associated with the face plate. The method also includes determining a difference between the face plate temperature and a predetermined temperature and modifying the temperature control signal provided to the bake plate in response to the determined difference.
申请公布号 US7831135(B2) 申请公布日期 2010.11.09
申请号 US20070849978 申请日期 2007.09.04
申请人 SOKUDO CO., LTD. 发明人 HERCHEN HARALD
分类号 A21B2/00;A21B1/00;C23C16/00 主分类号 A21B2/00
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