发明名称 Fabricating dielectric layer
摘要 A composition for forming a dielectric layer includes a liquid organometallic compound serving as a precursor with high dielectric constant, a photo-sensitive polymer or a non-photo-sensitive polymer and a solvent, wherein the liquid organometallic compound includes metal alkoxide, and the metal of the metal alkoxide includes Al Ti, Zr, Ta, Si, Ba, Ge and Hf. The dielectric layer formed by the composition includes the photo-sensitive polymer or the non-photo-sensitive polymer and an amorphous metal oxide formed therein.
申请公布号 US7829137(B2) 申请公布日期 2010.11.09
申请号 US20060308387 申请日期 2006.03.21
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 LIN WEI-LING;LIN PANG;HU TARNG-SHIANG;CHEN LIANG-XIANG
分类号 B05D5/12 主分类号 B05D5/12
代理机构 代理人
主权项
地址