发明名称 |
Packaging with base layers comprising alloy 42 |
摘要 |
A semiconductor packaging structure is provided. The structure includes a base layer comprising alloy 42; die attached on a first side of the base layer; and an interconnect structure on the die, wherein the interconnect structure comprises vias and conductive lines connected to the die.
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申请公布号 |
US7830004(B2) |
申请公布日期 |
2010.11.09 |
申请号 |
US20060588481 |
申请日期 |
2006.10.27 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WU GENE |
分类号 |
H01L23/06;H01L23/14 |
主分类号 |
H01L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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