发明名称 |
Conductive ball mounting method and apparatus having a movable solder ball container |
摘要 |
A method of mounting conductive balls on pads on a substrate includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.
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申请公布号 |
US7829451(B2) |
申请公布日期 |
2010.11.09 |
申请号 |
US20080174879 |
申请日期 |
2008.07.17 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SAKAGUCHI HIDEAKI;IIDA KIYOAKI;TANAKA KAZUO |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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