| 摘要 |
<p>PURPOSE: A package for multilayer chip is provided to laminate chips regardless of the size and the kind of chip. CONSTITUTION: A multiple layers chip package comprises a substrate(1000), a first chip(1100), a cavity pad(1020), a second chip(1200), and an upper pad(1050). The substrate comprises the cavity. The first chip is mounted on the substrate. The cavity pad is arranged on the substrate. The cavity pad is wire-bonded to the first chip. The second chip is arranged on the top of the first chip. The second chip is mounted in the substrate having a region without the cavity. The upper pad is arranged in the substrate without the cavity. The upper pad is wire-bonded with the second chip. The length of cavity is longer than that of the second chip.</p> |
