UNIVERSAL INTER-LAYER INTERCONNECT FOR MULTI-LAYER SEMICONDUCTOR STACKS

摘要

PURPOSE: An interlayer interconnection for a multilayer semiconductor stack is provided to easily perform a communication between functional units using a universal and standardized interlayer bus. CONSTITUTION: Contact pads(22) are arranged on the surface of a semiconductor die(12). A gray pad(24) is interposed in an interlayer interface region(18). The gray pad is combined with a conductor for an interlayer bus. A black pad(26) is combined with a positive voltage or a ground. A white pad is electrically separated from an active circuit.