| 摘要 |
PURPOSE: A light emitting element package and a method for manufacturing the same are provided to improve heat emitting efficiency by widening a heat emitting area from the bottom side to the lateral side of a light emitting element chip. CONSTITUTION: A groove is formed on the upper side of a package body. A light emitting element chip(100) is arranged in the groove of the package body. The light emitting element chip includes a light emitting structure(120) formed on a substrate(110). The light emitting structure includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. |
