发明名称 METHOD OF FORMING EXTERNAL ELECTRODE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To obtain the method of forming an external electrode of an electronic component which forms the external electrode having sufficient thickness on a corner portion of an electronic component body without generating crack and chip in the electronic component body. SOLUTION: Conductive paste 40 is supplied so that a concavity 32 in the periphery of a protruded portion 34 is filled in one principal surface 30a side of a first surface plate 30. The end surface 12a of a capacitor body 12 for use as an electronic component body is pressed on the upper surface of the protruded portion 34 and the conductive paste 40 is adhered to a corner portion 20 of the end surface 12a. The conductive paste 40 is applied onto the end surface 12a by immersing the end surface of the capacitor body 12 in which the conductive paste 40 is adhered to the corner portion 20 in the conductive paste 40 supplied to a second surface plate. An external electrode is formed on the end surface 12a of the capacitor body 12 by printing the conductive paste 40. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010251584(A) 申请公布日期 2010.11.04
申请号 JP20090100727 申请日期 2009.04.17
申请人 MURATA MFG CO LTD 发明人 HARADA TOSHIHIRO;NISHIKAWA JUN
分类号 H01G4/30;H01G4/12;H01G4/252 主分类号 H01G4/30
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