| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for detecting the amount of machining such as polishing amount without connection by wire bonding. SOLUTION: A polishing device includes: a capacitor 5 formed of a conductive pattern, which changes in volume by polishing, on an object 2 to be polished; and an inductor 4 formed of a conductive pattern on the side of the object to be polished. The capacitor 5 and the inductor 4 on the side of the object to be polished configure an LC resonator. Also, an inductor 3 on a detection side, formed of a conductive pattern, is provided on a detection substrate 1 connected to a polishing amount detector 7. Through electromagnetic coupling between the inductor 4 on the side of the object to be polished and the inductor 3 on the detection side, impedance seen from the detection side to the side of the object to be polished is RF-detected. By polishing, the capacitance 5 of the object 2 to be polished varies, and according thereto, the polishing amount is calculated by monitoring a varied amount of a resonant frequency of the LC resonator using the polishing amount detector 7. COPYRIGHT: (C)2011,JPO&INPIT
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