| 摘要 |
PROBLEM TO BE SOLVED: To reduce a region required to mount a semiconductor element and a wiring board, in comparison with the case of securing a space for the escape of a surplus part of an adhesive film, when mounting the semiconductor element to the board using the adhesive film of outline dimensions which are larger than ideal dimensions. SOLUTION: A display includes a drive board 3, having a display region E1 and a non-display region E2; the semiconductor element 5 mounted on the non-display region E2 of the drive board 3 using the adhesive film 7; and the wiring board 6 mounted on the non-display region E2 of the drive board 3, side by side with the semiconductor element 5. The display is manufactured by carrying out a first mounting process for mounting the wiring board 6 on the non-display region E2 of the drive board 3 via the adhesive film 8, and a second mounting process for mounting the semiconductor element 5 on the non-display region E2 of the drive board 3, side by side with the mounted wiring board 6, after sticking the adhesive film 7 to the non-display region E2 of the drive board 3. COPYRIGHT: (C)2011,JPO&INPIT
|
