| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that a conventional stress measuring apparatus using a strain gage is difficult to conduct an stress measurement since a strain gage material is stuck on a strain generating part by an adhesive, and the adhesive is peeled at a high temperature. SOLUTION: A stress measuring apparatus 30 is provided, which includes: an oxygen ion conductive film 32 formed so as to be sintered in the shape of a film on a surface of an object to be measured 31; a resistance meter 33 for measuring a resistance value between at least two points of the oxygen ion conductive film 32; and a calculating device for calculating a stress applied dynamically to an area between at least two points of the object 31, based on the resistance value measured by the resistance meter 33. The oxygen ion conductive film 32 is sintered in the shape of the film on the surface of the object 31, and furthermore the oxygen ion conductive film 32 is resistant to the high temperature. Hence, the oxygen ion conductive film 32 is never peeled from the object 31, and the oxygen ion conductive film 32 is never broken when measuring the stress of the object 31 in the high-temperature state. COPYRIGHT: (C)2011,JPO&INPIT
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