| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooler capable of alleviating stress generated at a brazing process and the like, and suppressing damage of a heating element mounting substrate or warpage of the cooler, with a simple and low-cost structure. SOLUTION: A cooler 10 for HV inverters has a top plate 11, a bottom plate 12, and a fin 17, as main configuration members. The top plate 11 has a recessed part 18 formed on a junction surface to which an insulating substrate 31 is joined, a circumference groove 19a formed at least a part of the circumference of the junction surface, and a gap groove (19b) formed with remaining a part of a gap of the junction surface. In addition, a slit 20 is provided to the fin 17 at a position corresponding to a position immediately under the junction surface along a direction of repeating wave shapes. Further, a thickness ratio of the top plate 11 and the bottom plate 12 is 1:3 to 1:10 (NOCOLOK(R) brazing). COPYRIGHT: (C)2011,JPO&INPIT
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