| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device and a mounting method of a semiconductor device, being excellent in connection reliability. SOLUTION: The mounting structure of the semiconductor device includes a first substrate 24 in which a plurality of first terminals 47a are arrayed along a predetermined direction, with a liquid repellent part 2 formed between the first terminals, a second substrate 27 which is formed to correspond to the first terminal 47a, with a plurality of second terminals 73 formed in such dimension, in top view, as smaller than that of the first terminal 47a being arrayed, an anisotropic conductive bonding agent 79 which is sandwiched between the first terminal 47a and the second terminal 73, comprising a material phobic to the liquid repellent part 2, to electrically connect the first terminal 47a and the second terminal 73 together, and a semiconductor element provided to either the first substrate 24 or the second substrate 27. COPYRIGHT: (C)2011,JPO&INPIT
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