发明名称 ADHESIVE COMPOSITION, AND ADHESIVE SHEET AND COVERLAY FILM USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an adhesives composition, free from any halogen compound and other materials giving load to environment, that is excellent in storability in a semi-cured state and is excellent in adhesiveness, heat resistance, migration resistance, and flame resistance in a cured state, and to provide an adhesive sheet and coverlay film using the composition. SOLUTION: The adhesive composition includes (A) a non-halogen-based epoxy resin, (B) a synthetic rubber, (C) a curing agent not having two or more thiol groups, (D) a polythiol compound having two or more thiol groups, (E) a curing accelerator, and (F) an inorganic filler. The adhesive sheet has a mold release base material and an adhesive layer comprising the adhesive composition prepared at least on one side of the mold release base material. The coverlay film has an electric insulation film and an adhesive layer comprising the adhesive composition prepared at least on one side of the electric insulation film. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010248380(A) 申请公布日期 2010.11.04
申请号 JP20090099658 申请日期 2009.04.16
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 KONDO KAZUNORI;FUJII YOSHITO;USU MASAHIRO;AMANO TADASHI
分类号 C09J163/00;C09J7/02;C09J121/00;H05K3/28 主分类号 C09J163/00
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