发明名称 |
Semiconductor Chip Package with Stiffener Frame and Configured Lid |
摘要 |
Various semiconductor chip packages and methods of assembling and making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a stiffener frame to a first side of a substrate. The stiffener frame has a central opening to accommodate a semiconductor chip and an outer edge surface. A semiconductor chip is coupled to the first side in the opening. A lid is coupled to the stiffener frame with an adhesive. The lid has a first edge surface set back from the outer edge surface of the stiffener frame. The adhesive is set back from the outer edge surface of the stiffener frame.
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申请公布号 |
US2010276799(A1) |
申请公布日期 |
2010.11.04 |
申请号 |
US20090435147 |
申请日期 |
2009.05.04 |
申请人 |
HENG STEPHEN F;DANDIA SANJAY;LEONG CHIA-KEN |
发明人 |
HENG STEPHEN F.;DANDIA SANJAY;LEONG CHIA-KEN |
分类号 |
H01L23/04;H01L21/50 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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