PACKAGED INTEGRATED CIRCUIT DEVICE, OPERATING METHOD THEREFOR, MEMORY STORING DEVICE HAVING THE SAME, AND ELECTRONIC SYSTEM

摘要

PROBLEM TO BE SOLVED: To obtain a multi-chip packaged integrated circuit device providing reduced signal skew and related methods of operation.

SOLUTION: A packaged integrated circuit device includes a substrate including a conductive pad thereon, a chip stack including a plurality of chips on the substrate, a primary conductive line, and secondary conductive lines. The primary conductive line electrically connects the conductive pad on the substrate to a conductive pad on one of the plurality of chips in the chip stack. The secondary conductive lines electrically connect the conductive pad on one of the plurality of chips in the chip stack to corresponding conductive pads on one of the plurality of chips above the one of the plurality of chips and one of the plurality of chips below the one of the plurality of chips.

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