| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting board suppressing generation of voids in a solder connection part with high reliability, and to provide a mounting structure. SOLUTION: This electronic circuit board includes: a circuit board for mounting an electronic component thereon; a ground pattern arranged at a position for mounting an electronic circuit board on a surface of the circuit board; a ground layer arranged on a surface of the circuit board opposite to the ground pattern; a plated through-hole penetrating through the plated ground pattern and the ground layer; and a non-plated through-hole penetrating through the non-plated ground pattern and the ground layer. In the non-plated through-hole, the vicinity of the ground pattern is formed into a tapered shape, and an area from the center part of the circuit board to the ground layer side is linear. Occurrence of voids in the solder can be prevented without causing the capillary phenomenon of the solder in the vicinity of the ground pattern. COPYRIGHT: (C)2011,JPO&INPIT
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