| 摘要 |
Provided is a semiconductor integrated circuit chip mounted on a substrate by flip-chip bonding, wherein an IO cell is not arranged and a saved region is effectively used. A semiconductor integrated circuit chip (1) is provided with: a plurality of electrode pads (10); a corner section (15a) on a flat circumference of an internal layer; a first linear region (15b) adjacent to one side of the corner section; a second linear region (15c) adjacent to other side of the corner section; and a third linear region (15d), which is on the opposite side to the corner section and is adjacent to the first linear region. A circuit core arranging region (18) is arranged at least on the corner section or on the first linear region, and in the second and the third linear regions, a plurality of IO cells (11) respectively connected to the electrode pads are arranged. The IO cells in the second linear region are respectively connected to the electrode pads, which are arranged inward within (n) rows and (n) columns from the corner section of the chip, i.e., an upper section of the corner section. |
