PRINT CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent the reduction of the entire height of a bump by reflowing only the solder layer of the bump during a flip-chip process. CONSTITUTION: A printed circuit board comprises a substrate(210), a metal post(230), and a solder layer(240). A pad(212) is formed on the substrate. The metal post is formed on the pad in order to be electrically connected to the pad. The metal post is made of a low resistive material. The solder layer is formed on the side and the upper side of the metal post in order to cover the exposed surface of the metal post. A seed layer is interposed between the pad and the metal post.