| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in printed wiring board which has high reliability without causing a defect of electrical connection of an inner layer even when soldering an electronic component onto an outer layer. <P>SOLUTION: The component built-in printed wiring board is provided with a land wiring pattern 56b which has a land opening hole on a first insulating resin layer, a chip component is bonded on a wiring pattern with a non-conductive adhesive resin film 7, an electrode 31 of the chip component is abutted on the land, an opening prepreg on which a prepreg opening portion to avoid the chip component is formed on the insulating resin layer and wiring pattern, and a filled via-hole 55b electrically connects a part of land and an electrode on a land opening hole with metal plating from the first insulating resin layer side. <P>COPYRIGHT: (C)2011,JPO&INPIT |
