| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic components and a device for applying conductive paste, capable of properly transferring the conductive paste onto a chip element assembly. SOLUTION: In the method of manufacturing the electrical components, the chip element assembly is prepared, a roller 12 in which a groove 18 is formed in a circumferential side face 12b is prepared, the conductive paste is provided for the circumferential side face 12b of the roller 12, by scraping excessive conductive paste from the circumferential side face 12b of the roller 12 by a blade 14 having a recess 20 at a position corresponding to the groove 18, the groove 18 is filled with the conductive paste. By pressing the chip element assembly onto the circumferential side face 12b of the roller 12 while crossing the groove 18, the conductive paste filled in the groove 18 is transcribed to the chip element assembly. COPYRIGHT: (C)2011,JPO&INPIT
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