| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package which can suppress formation of a void (bubble), and can prevent a semiconductor package from being large-sized. <P>SOLUTION: The method of manufacturing the semiconductor package, having a semiconductor chip mounted on one surface of a wiring board with a sheet-like resin interposed, includes: a holding process of holding the sheet-like resin 25 on a projection portion side of a holding tool 27 having a projection portion projecting from a surface opposed to the one surface of the wiring board 10 to the one surface side of the wiring board; a pressing process of pressing a tip of a portion, which is held by the holding tool to deform in a projection shape, of the sheet-like resin in contact with a flat portion of the one surface of the wiring board; and a temporarily fixing process of releasing sheet-like resin from being held by the holding tool, and temporarily fixing the sheet-like resin to the one surface of the wiring board. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
