| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing liquid which is used for a barrier metal CMP grinding a barrier layer consisting of a barrier metal material and suppresses roughening of a surface after polishing and can realize a reduction of dishing, and further to provide a chemical mechanical polishing method using the polishing liquid. <P>SOLUTION: The invention relates to the chemical mechanical polishing liquid containing: (A) colloidal silica; (B) an oxidizing agent; and (C) a compound expressed by Formula (1). In Formula (1), X and Y respectively and independently denote a five-membered ring containing at least one nitrogen atom. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
