| 摘要 |
PROBLEM TO BE SOLVED: To achieve miniaturization of portable equipment by downsizing a board and eliminating a dead space between the board and a chassis when accommodating the board into the case after mounting electronic components onto the board. SOLUTION: When accommodating the board into the case after mounting electronic components onto a film with interconnects which is the board, the film is folded and its inner faces made to face with each other, which is the board on which electronic components are mounted, and to be accommodated by inserting an insulation material such as resin therebetween. Thereby, electrodes of the film or electrical components can be prevented from short circuit, so that the board can be downsized and it is possible to miniaturize portable equipment. COPYRIGHT: (C)2011,JPO&INPIT
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