| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device reduced in size by mounting a piezoelectric element and a ferroelectric element together on a single chip, and also to provide a manufacturing method of the same. SOLUTION: The semiconductor device 1 is provided with the piezoelectric element 3 and the ferroelectric element 2 which are mounted on a same substrate. A ferroelectric film 15b that constitutes the ferroelectric element 2 is formed of the same material as that of at least a part of a piezoelectric film 4 that constitutes the piezoelectric element 3. COPYRIGHT: (C)2011,JPO&INPIT
|
