发明名称 RESIN SEALING APPARATUS AND RESIN SEALING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To finish a resin sealed section of a resin sealed article consistently in a state free from unevenness by performing resin sealing by uniformly applying a molding resin to a cavity space. SOLUTION: A resin sealing apparatus is equipped with stockers 130A, B which stock granular molding resins 120A, B according to each particle size range, a molding resin supply amount calculation means PC, a molding resin pulling out means to take out the granular molding resins 120A, B based on the supply amount calculated, a loading means 160 for loading the granular molding resins 120A, B, and an injection means for injecting the granular molding resins 120A, B to a lower mold 230 by reciprocating the loading means 160 between a loading position and a mold position, wherein the supply amount calculation means PC conducts a calculation based on the reserved amount of the granular molding resins 120A, B in the stocker 130A, B and the amount of the granular molding resins 120A, B used in the resin sealing of an electronic component 240 so that respective ratios of supply amount of the granular molding resins 120A, B out of stockers 130A, B may become a given ratio. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010247429(A) 申请公布日期 2010.11.04
申请号 JP20090099322 申请日期 2009.04.15
申请人 APIC YAMADA CORP 发明人 MIYAJIMA FUMIO
分类号 B29C43/34;B29B13/00;B29C31/06;B29C43/18;B29C43/58;H01L21/56 主分类号 B29C43/34
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